Enabling the Technologies for Semicon - Digital Event
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Events - PI (Physik Instrumente) L.P.

Enabling the Technologies for Semicon - Digital Event

IT’S POSSIBLE SESSIONS – ENABLING THE TECHNOLOGIES FOR SEMICON – November 30, 9 am EST & PST

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Following our successful Future of Laser Materials Processing digital event earlier this year, we are hosting a tech-talk live streaming event on the topic of Enabling the Technologies for Semicon, with speakers from ASML, Zeiss, FormFactor, ACS Motion Control, and PI.

Semiconductor technology represents one of the most important industry sectors in the world paving the way for progress in many technological areas including, computing, data storage, signal processing, and opto-electronics. More advanced semiconductor components are the prerequisite for essential developments in 6G technology, Internet of Things (IoT), Cloud and Edge Computing, or Electric and Autonomous Vehicles.

Join us in our Enabling the Technologies for Semicon digital event, where we bundle knowledge about market trends and technologies in order to meet the needs of industry and end customers - now and in future. You can expect exciting presentations from experts on applications, manufacturing requirements and solutions.

Let us inspire and excite you!

 

Agenda
Keynote: Pushing Boundaries – Together!, Markus Spanner I CEO I PI

Keynote: The Relentless Pursuit of Precision at ASML, Steven Steen I Director of Product Management 3D Solutions I ASML​

Session 1: EUV Lithography in High Volume Manufacturing,​ Dr. Christian Karlewski I Lead Systems Engineer I Carl Zeiss SMT

Session 2: Precision Wafer Level Photonics Probing for the Semiconductor Industry, Dan Rishavy I Director of Market Development I FormFactor

Session 3: Solutions to Move Mo(o)re, Cliff Y. F. Huang I Head of Segment Marketing Semiconductor I PI

Session 4: Maximizing SEMI Equipment Throughput With Motion Control Innovations, Jason Goerges I General Manager North America & Global VP of Marketing I ACS

It’s Possible Conclusion & Goodbye

 

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Solutions for Semiconductor Manufacturing

Physik Instrumente – Wafer Inspection

Wafer Inspection & Metrology

The entire chip manufacturing process consists of 400 to 800 production steps. At all critical points in the manufacturing process, inspection processes are essential to ensure the high quality and reliability of the final products.

Physik Instrumente Wafer and Substrate Inspection

Film Metrology in Wafer Inspection

PI is currently developing motion solutions for wafer positioning to facilitate the measurement of crucial wafer attributes.

Physik Instrumente – Wafer Dicing

Wafer Stealth Dicing

In the production of chips and microchips, it is necessary to separate the individual dies from the wafer. In this process, quality and precision are crucial for all further post-fab operations. Laser dicing has therefore become the preferred dicing technology.

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