Laser Processing Applications Overview

When laser drilling the smallest high-density holes, many factors such as cone shape control as well as spot size and wavelength of the laser will have an impact on the result. In addition, fast and precise positioning of the workpiece, the laser head and the laser focus height is important.

For the safe and reliable operation of sensitive electronic components or assemblies, the components’ housing must be sealed hermetically to protect the microsystem from damage caused by contaminants seeping in. Using lasers for seam formation enables high welding speeds, as well as fine welding seams with narrow welding radiuses.

The processing of high-density structures over large areas such as laser drilling or laser marking of PCBs requires solutions that provide high precision and high throughput. The combination of multi-axis positioning systems with a highly dynamic galvanometer scanner can address the needs of industrial production.

Machining platforms for creating tiny geometries in the micron range demand motion systems that provide a consistent, accurate and dynamic processing in multiple dimensions.

Manufacturing chips and microchips involves cutting the wafers, using a process known as wafer dicing, into small square or rectangular “chips” or “die”. Typical challenges to consider in wafer dicing applications are: To position the cut accurately, to minimize the losses of material, and to minimize distortions of the components.

Reducing design and development time is a decisive competitive factor in precision automation. This is why companies striving for optimum performance in areas such as laser processing or metrology should rely on a powerful, well-coordinated system. PI supports this approach with the preconfigured X-417 Integrated Multi-Axis System (IMAS).

When confronted with health problems, medical technology today makes it possible for implants, for example pacemakers or insulin pumps, to perform important functions. Such implants are highly complex systems consisting of electrical and electronic components. Hermetic sealing, which keeps the microsystem and the surrounding tissue reliably separated from each other, is necessary for safe and...

Lasers are used today in a wide variety of industrial applications in order to further optimize production processes and guarantee high workpiece quality. Laser machining processes can as well be significantly improved by high-frequency oscillation of the laser beam in the XY plane.

A gantry precision positioning stage is sometimes called a linear robot or Cartesian robot. Gantries typically provide motion in 2 or 3 linear degrees of freedom (X-Y and X-Y-Z) and are often used for pick and place applications, 3D printing or laser machining, and welding applications.

High performance motorized stages, designed for heavy duty applications in industrial precison automation.

Air bearings provide advantages over mechanical bearings when vibration-free motion is required, highly constant velocity control is crucial, and when angular repeatability and geometric performance must be optimal.