As global demand for silicon photonics integrated circuits surges, high-volume manufacturing has become vital to support this rapid growth. PI’s cutting-edge technologies offer unparalleled precision, speed, and reliability in probing and testing applications, ensuring production-ready performance at scale.

Integrating photonic structures or elements such as waveguides, photodiodes, lasers, and multiplexers presents a variety of demanding challenges to test and assembly processes, starting at wafer level through to final packaging.

As the global reliance on photonics grows, the industry demands new solutions for testing and assembly. PI provides high-end alignment systems for applications where throughput is key, as well as affordable alignment engines based on modular precision positioning stages.

Piezoelectric or electromagnetic Fast Steering Mirrors (FSM) from PI provide angular resolution down to the nanorad scale with a mechanical bandwidth reaching up to the kHz range. These mirrors effectively compensate for common disturbances in various applications.

Efficient wafer inspection and metrology are essential for ensuring a stable, high-performance semiconductor manufacturing process. With up to 800 complex production steps, semiconductor fabrication demands precise inspection and metrology at every critical stage to guarantee the highest levels of quality and yield.

Optical inspection is an essential process in industrial quality assurance. Optical inspection systems, which are used in industrial environments, should provide reliable and repeatable measurement results and enable high throughput rates.

The entire chip manufacturing process consists of 400 to 800 production steps. At all critical points in the manufacturing process, inspection processes are essential to ensure the high quality and reliability of the final products.

The processing of high-density structures over large areas such as laser drilling or laser marking of PCBs requires solutions that provide high precision and high throughput. The combination of multi-axis positioning systems with a highly dynamic galvanometer scanner can address the needs of industrial production.

When laser drilling the smallest high-density holes, many factors will impact the result: cone shape control as well as spot size and wavelength of the laser. Fast and precise positioning of the workpiece, the laser head, and the laser focus height are equally important.

Reducing design and development time is a decisive competitive factor in precision automation. This is why companies striving for optimum performance in areas such as laser processing or metrology should rely on a powerful, well-coordinated system. PI supports this approach with the preconfigured X-417 Integrated Multi-Axis System (IMAS).

Superresolution microscopy requires precise, reliable, and reproducible sample positioning, objective alignment, and imaging system integration. With its advanced piezo-driven technology, PI’s ultrasound-based microscope platform offers exceptional precision, making it the perfect choice for demanding tasks in modern microscopy.